产品目录  棕化RTU-65  棕化SD-288  AP-6000  DP-1000  除胶  PTH  镀铜  SOP-1000 Process part Process Products Attributes & Functions Main Usages Pre Treatment Cleaner 110/110HS Removing the oxide, duty, fingerprint Pre-process de-oiling of Regular PCB 115 Etching 120 Form roughness on surface to enhance bonding FPCB/Regular PCB 120S 121S 123 123 130 135 140 150 Soda Ash 180 Dry Film removal Regular PCB Brown Oxide De-oil 210 Removes oxide film, dust and finger prints from copper film surface Regular PCB Pre-dip 240 Prevents infusion of other chemicals into oxide Regular PCB Oxide 260 Acidic oxide agent with strong acid-endurance and provides oxide film of organic metal FPCB/Regular PCB De-oil 270 Removes oxide film, dust and finger prints from copper film surface Regular PCB Oxide 280 Turns interior layer copper film surface into dark copper oxide Regular PCB Oxide 290 Enhances bonding between interior circuit layers and post-process black oxides Regular PCB De-smear Sweller 310/315 Clean smudges and oil from surface; removes epoxy residue inside holes FPCB/Regular PCB De-smear 340 Removes drill smear on epoxy surfaces with fiber residue Neutralizer 370 Removes foreign matters from inside holes PTH De-oil 410/410P Removes oil from glass fiber surfaces and epoxy surfaces to maximize catalyst or bonding function FPCB/Regular PCB/EMI Pre-dip 430/435 Protects catalyst Catalyst 440/445 Catalyst is bonded on surfaces Activation 450/455 Bonded catalyst is augmented Chemical Copper 460/460F/465 Copper plating of Through Holes on PCB 4650 Assign conductivity through EMI plating Immersion Tin De-oil 510 Removes finger prints and other pollutants from PCB surfaces FPCB/Regular PCB/EMI Etching 520 Forms roughness on surface to enhance bonding Tin Plating 560 Forms uniform level Tin plating layer of 0.8~1.2 on copper film surface ENIG De-oil 610 Removes oxide film, dust and finger prints from PCB surface FPCB/Regular PCB non-iron, steel, cast iron, etc. Etching 620 Forms roughness on surface to enhance bonding Activation 640 Bonds Palladium on copper areas to act as activator catalyst for extraction of nickel Nickel Plating 660 Under layer plating for gold plating Gold Plating 680 Substitution type strike, non-electrolytic plating with excellent corrosion-resistance and solderability of Nickel Stripper Lead Removal 711/715 Sn/Pb removal agent of nitric acid base FPCB/ Regular PCB Rack Removal 720 Removes Sn/Pb and Du extracted in plating tub and rack Dry Film Removal 730/731/740 Dry Film removal agent Acid Etching 760 Copper film etching for circuit formation in Panel Manufacturing Process Alkali Etching 771 Copper film etching for circuit formation in Panel Manufacturing Process Electrolytic Plating Electric copper brightener 810/813 Additive for electric copper plating over non-electrolytic copper plating FPCB/ Regular PCB Solder brightener 830 Additive to solder plating solution for pattern protection Regular PCB Others PSR Removal Agent 960 Completely removes fully hardened dry film and photo-imageable solder mask Regular PCB Oxidation prevention agent 970 Concentrated oxidization prevention agent that delays surface oxidation as much as possible on electrolytic copper plating, non-electrolytic copper plating, silver plating, solder plating and non-iron metals FPCB/ Regular PCB Defoaming agent 980 Defoaming agent of non-silicon type added to development agent and peeling agent of dry film, PSR and LPR Ink FPCB/ Regular PCB Equipment detergent 990 Washing liquid of spray type to wash spray devices (development, etching and peeling) Regular PCB